Considering Fig. 10.25, at least how many images are needed to figure out the interconnections of this chip?
1. Assuming that a shield is placed on the top layer of the chip, the shield width is 150 nm, the shield space is 500 nm, the shield wire thickness is 200 nm, a target wire is on metal 2 and the shield to target layer depth is 5000 nm, what is the maximum FIB aspect ratio that this shield can protect against?
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