Recently a troublesome failure mechanism known as stress voiding has surfaced in sub micrometer-wide Al interconnections. It is apparently caused by residual stress in the metal film and is manifested...


Recently a troublesome failure mechanism known as stress voiding has surfaced in sub micrometer-wide Al interconnections. It is apparently caused by residual stress in the metal film and is manifested by slit like cracks at grain boundaries that eventually cause open circuits. Even unpowered chips are prone to such degradation.



Jan 13, 2022
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